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Time-Multiplexed 1687-Network for Test Cost Reduction

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dc.contributor.authorAnsari, Muhammad Adil-
dc.contributor.authorJung, Jihun-
dc.contributor.authorKim, Dooyoung-
dc.contributor.authorPark, Sungju-
dc.date.accessioned2021-06-22T11:42:17Z-
dc.date.available2021-06-22T11:42:17Z-
dc.date.created2021-01-21-
dc.date.issued2018-08-
dc.identifier.issn0278-0070-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/5740-
dc.description.abstractThe reconfigurable scan network standardized by IEEE std. 1687 offers flexibility in accessing the on-chip instruments, which significantly improves the test cost. In this paper, we present a novel time-multiplexed 1687-network architecture that significantly improves the absolute test application time of systems-on-chip at wafer-level as well as package-levels tests. This architecture leverages: 1) the ever increasing tester channel frequency; 2) the allowed test frequencies at the two test levels; and 3) the flexibility offered by the 1687-network. We also present a test-time calculation method for the proposed network architecture and use it in our experiments. Furthermore, we study the effects of the number of time slots on different parameters.-
dc.language영어-
dc.language.isoen-
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.titleTime-Multiplexed 1687-Network for Test Cost Reduction-
dc.typeArticle-
dc.contributor.affiliatedAuthorPark, Sungju-
dc.identifier.doi10.1109/TCAD.2017.2766146-
dc.identifier.scopusid2-s2.0-85032446527-
dc.identifier.wosid000439381700013-
dc.identifier.bibliographicCitationIEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, v.37, no.8, pp.1681 - 1691-
dc.relation.isPartOfIEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS-
dc.citation.titleIEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS-
dc.citation.volume37-
dc.citation.number8-
dc.citation.startPage1681-
dc.citation.endPage1691-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.description.journalClass1-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaComputer Science-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalWebOfScienceCategoryComputer Science, Hardware & Architecture-
dc.relation.journalWebOfScienceCategoryComputer Science, Interdisciplinary Applications-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.subject.keywordPlusSYSTEM-ON-CHIP-
dc.subject.keywordPlusTEST ACCESS MECHANISM-
dc.subject.keywordPlusPOWER CONSTRAINTS-
dc.subject.keywordPlusIEEE P1687-
dc.subject.keywordPlusOPTIMIZATION-
dc.subject.keywordPlusDESIGN-
dc.subject.keywordPlusSOCS-
dc.subject.keywordPlusWRAPPER-
dc.subject.keywordAuthorDesign-for-testability-
dc.subject.keywordAuthorIEEE std 1687-
dc.subject.keywordAuthorpackage-level test-
dc.subject.keywordAuthorscan test-
dc.subject.keywordAuthortime division multiplexing-
dc.subject.keywordAuthorwafer-level test-
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8081843-
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