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Time-Multiplexed 1687-Network for Test Cost Reduction

Authors
Ansari, Muhammad AdilJung, JihunKim, DooyoungPark, Sungju
Issue Date
Aug-2018
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Keywords
Design-for-testability; IEEE std 1687; package-level test; scan test; time division multiplexing; wafer-level test
Citation
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, v.37, no.8, pp.1681 - 1691
Indexed
SCIE
SCOPUS
Journal Title
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS
Volume
37
Number
8
Start Page
1681
End Page
1691
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/5740
DOI
10.1109/TCAD.2017.2766146
ISSN
0278-0070
Abstract
The reconfigurable scan network standardized by IEEE std. 1687 offers flexibility in accessing the on-chip instruments, which significantly improves the test cost. In this paper, we present a novel time-multiplexed 1687-network architecture that significantly improves the absolute test application time of systems-on-chip at wafer-level as well as package-levels tests. This architecture leverages: 1) the ever increasing tester channel frequency; 2) the allowed test frequencies at the two test levels; and 3) the flexibility offered by the 1687-network. We also present a test-time calculation method for the proposed network architecture and use it in our experiments. Furthermore, we study the effects of the number of time slots on different parameters.
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