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A Multiband Directional Coupler Using SOI CMOS for RF Front-End Applications

Authors
Ji, DonghyeonKim, Junghyun
Issue Date
Feb-2018
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Keywords
Coupling switching; directional coupler; dual coupler; front-end stage; RF switch; silicon on insulator (SOI)
Citation
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.28, no.2, pp 126 - 128
Pages
3
Indexed
SCI
SCIE
SCOPUS
Journal Title
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS
Volume
28
Number
2
Start Page
126
End Page
128
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/6796
DOI
10.1109/LMWC.2017.2783196
ISSN
1531-1309
1558-1764
Abstract
This letter introduces a novel multiband directional coupler for RF front-end applications. Conventional narrowband directional couplers are widely used for mobile applications because of their compact size. However, excessive power loss due to strong coupling in the higher frequency range severely limits their bandwidth. To resolve this issue, we propose a dual directional coupler employing a coupling switching stage, where the asymmetric coupled lines can be electrically coupled or floated to mitigate severe coupling loss. The proposed coupler has been implemented to an integrated circuit using the silicon-on-insulator process. The measured results showed a considerably enhanced bandwidth from 0.69 to 4 GHz covering the entire frequency band of long-term evolution with a low power loss of less than -0.21 dB in the target frequency range.
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KIM, JUNG HYUN
ERICA 공학대학 (SCHOOL OF ELECTRICAL ENGINEERING)
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