Particle Deposition and Adhesion

Abstract

Contamination by small particles is a major problem in many industries such as semiconductor, storage, imaging, pharmaceutical, aerospace, automotive, food, and medical equipment. This chapter covers the particulate contamination that may occur during the processing of wafers for integrated circuit manufacturing. The first part of this chapter focuses on particle transport and deposition mechanisms in both gaseous and liquid media including all possible forces that may affect the particles. Later parts of the chapter cover particle adhesion, with a description of various forces involved in the mechanisms of adhesion, including adhesion force measurements. The final section summarizes adhesion forces and additional information about particle removal as related to adhesion and transport. © 2018 Elsevier Inc. All rights reserved.