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Effective Methods Controlling Cu Overburdens for Cu RDL Process
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Park, Kimoon | - |
| dc.contributor.author | Lee, Jinhyun | - |
| dc.contributor.author | Yoo, Bongyoung | - |
| dc.date.accessioned | 2021-06-22T13:03:04Z | - |
| dc.date.available | 2021-06-22T13:03:04Z | - |
| dc.date.issued | 2018-06 | - |
| dc.identifier.issn | 0000-0000 | - |
| dc.identifier.issn | 2380-6338 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/7950 | - |
| dc.description.abstract | Microcontact printing (μCP) and electrochemical polishing (ECP) were proceeded for the Cu overburden thickness reduction and Cu planarization during the redistribution layer process. The suppressing property of μCP and the polishing effect of ECP were confirmed by electrochemical analysis. Suppressing effect of top surface of trench was confirmed after the μCP and Cu filling, and the removal of Cu overburdens was also confirmed after the Cu filling and the ECP. © 2018 IEEE. | - |
| dc.format.extent | 3 | - |
| dc.language | 영어 | - |
| dc.language.iso | ENG | - |
| dc.publisher | Institute of Electrical and Electronics Engineers Inc. | - |
| dc.title | Effective Methods Controlling Cu Overburdens for Cu RDL Process | - |
| dc.type | Article | - |
| dc.publisher.location | 미국 | - |
| dc.identifier.doi | 10.1109/IITC.2018.8430290 | - |
| dc.identifier.scopusid | 2-s2.0-85052525301 | - |
| dc.identifier.wosid | 000468672900035 | - |
| dc.identifier.bibliographicCitation | 2018 IEEE International Interconnect Technology Conference, IITC 2018, pp 106 - 108 | - |
| dc.citation.title | 2018 IEEE International Interconnect Technology Conference, IITC 2018 | - |
| dc.citation.startPage | 106 | - |
| dc.citation.endPage | 108 | - |
| dc.type.docType | Conference Paper | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.relation.journalResearchArea | Engineering | - |
| dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
| dc.subject.keywordPlus | Electrolytic polishing | - |
| dc.subject.keywordPlus | Polishing | - |
| dc.subject.keywordPlus | Electrochemical analysis | - |
| dc.subject.keywordPlus | FOWLP | - |
| dc.subject.keywordPlus | Micro contact printing | - |
| dc.subject.keywordPlus | Planarization | - |
| dc.subject.keywordPlus | Polishing effects | - |
| dc.subject.keywordPlus | Redistribution layers | - |
| dc.subject.keywordPlus | Suppressing effects | - |
| dc.subject.keywordPlus | Thickness reduction | - |
| dc.subject.keywordPlus | Electron device manufacture | - |
| dc.subject.keywordAuthor | Electropolishing | - |
| dc.subject.keywordAuthor | FOWLP | - |
| dc.subject.keywordAuthor | Microcontact printing | - |
| dc.subject.keywordAuthor | RDL | - |
| dc.subject.keywordAuthor | SAM | - |
| dc.identifier.url | https://ieeexplore.ieee.org/document/8430290 | - |
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Related Researcher
- Yoo, Bong young
- ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)