Effects of DC sputtering power and rapid thermal processing temperature on tungsten disulfide (WS2) thin films
- Authors
- Ma, Sang Min; Moon, Jongil; Kwon, Sang Jik; Cho, Eou-Sik
- Issue Date
- 22-Nov-2018
- Publisher
- TAYLOR & FRANCIS LTD
- Keywords
- Tungsten disulfide (WS2); DC sputtering; rapid thermal processing (RTP); atomic force microscopy (AFM); Hall measurement
- Citation
- MOLECULAR CRYSTALS AND LIQUID CRYSTALS, v.676, no.1, pp.105 - 113
- Journal Title
- MOLECULAR CRYSTALS AND LIQUID CRYSTALS
- Volume
- 676
- Number
- 1
- Start Page
- 105
- End Page
- 113
- URI
- https://scholarworks.bwise.kr/gachon/handle/2020.sw.gachon/3073
- DOI
- 10.1080/15421406.2019.1596209
- ISSN
- 1542-1406
- Abstract
- For the direct formation of two-dimensional (2D) tungsten disulfide (WS2) thin films with higher productivity and lower process temperature than conventional chemical vapor deposition (CVD), WS2 thin films were deposited on a sapphire glass substrate by direct current (DC) sputtering and subsequent rapid thermal processing (RTP). From the optical investigation by atomic force microscopy (AFM), it was possible to stable surface and observe more improvements at higher RTP temperatures irrespective of sputtering power. Hall measurements showed higher resistivity and lower carrier density at higher DC sputtering power in spite of the constant carrier mobility. Raman spectrum results showed lateral vibration of tungsten and sulfur atoms at temperatures above 700 degrees C. The directly formed WS2 thin films showed the improvements in structural and electrical characteristics as a semiconductor layer.
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - IT융합대학 > 전자공학과 > 1. Journal Articles
![qrcode](https://api.qrserver.com/v1/create-qr-code/?size=55x55&data=https://scholarworks.bwise.kr/gachon/handle/2020.sw.gachon/3073)
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.