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Highly uniform and reliable resistive switching characteristics of a Ni/WOx/p(+)-Si memory device

Authors
Kim, Tae-HyeonKim, SungjunKim, HyungjinKim, Min-HwiBang, SuhyunCho, SeongjaePark, Byung-Gook
Issue Date
Feb-2018
Publisher
PERGAMON-ELSEVIER SCIENCE LTD
Keywords
WOx RRAM; Bipolar resistive switching; Rapid thermal oxidation (RTO); MIS structure; Space-charge-limited current (SCLC)
Citation
SOLID-STATE ELECTRONICS, v.140, pp.51 - 54
Journal Title
SOLID-STATE ELECTRONICS
Volume
140
Start Page
51
End Page
54
URI
https://scholarworks.bwise.kr/gachon/handle/2020.sw.gachon/4113
DOI
10.1016/j.sse.2017.10.015
ISSN
0038-1101
Abstract
In this paper, we investigate the resistive switching behavior of a bipolar resistive random-access memory (RRAM) in a Ni/WOx/p(+)-Si RRAM with CMOS compatibility. Highly unifrom and reliable bipolar resistive switching characteristics are observed by a DC voltage sweeping and its switching mechanism can be explained by SCLC model. As a result, the possibility of metal-insulator-silicon (MIS) structural WOx-based RRAM's application to Si-based 1D (diode)-1R (RRAM) or 1T (transistor)-1R (RRAM) structure is demonstrated.
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