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Dopant concentration dependent resistive switching characteristics in Cu/SiNx/Si structure

Authors
Kim, SungjunKim, Min-HwiKim, Tae-HyeonCho, SeongjaePark, Byung-Gook
Issue Date
25-Nov-2016
Publisher
ELSEVIER SCIENCE SA
Keywords
Resistive random-access memory (RRAM); Silicon nitride (Si3N4); Dopant concentration; Switching mechanism
Citation
JOURNAL OF ALLOYS AND COMPOUNDS, v.686, pp.479 - 483
Journal Title
JOURNAL OF ALLOYS AND COMPOUNDS
Volume
686
Start Page
479
End Page
483
URI
https://scholarworks.bwise.kr/gachon/handle/2020.sw.gachon/7680
DOI
10.1016/j.jallcom.2016.06.055
ISSN
0925-8388
Abstract
In this paper, dopant concentration dependent resistive switching characteristics in a SiNx-based resistive random-access memory (RRAM) device are investigated. The device with low dopant concentration (similar to 10(18) cm(-3)) shows only unipolar switching due to the suppressed reverse current. The result of conduction mechanism analyses for LRS indicates that conducting transport follows the thermionic emission, which has a strong temperature dependence. On the other hand, both unipolar and bipolar switching are observed in the device with high dopant concentration (similar to 10(20) cm(-3)). It is found that forward current/reverse current (F/R) ratio can be maximized by reducing doping concentration and compliance current (I-CC). (C) 2016 Elsevier B.V. All rights reserved.
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