Quach, N.V.; Pham, Q.N.; Han, J.-H.; Suh, Y.; Park, J.-S.; Won, Y.
ConferenceIssue Date2020CitationASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020PublisherAmerican Society of Mechanical EngineersPlaceUS; Virtual, Online