Detailed Information

Cited 0 time in webofscience Cited 0 time in scopus
Metadata Downloads

Surface engineering through atomic layer deposition on three-dimensionally structured materials

Authors
Quach, N.V.Pham, Q.N.Han, J.-H.Suh, Y.Park, J.-S.Won, Y.
Issue Date
27-Oct-2020
Publisher
American Society of Mechanical Engineers
Citation
ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/8519
Conference Name
ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020
Place
US
Virtual, Online
Conference Date
2020-10-27
ISSN
0000-0000
Files in This Item
There are no files associated with this item.
Appears in
Collections
서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers

qrcode

Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.

Related Researcher

Researcher Park, Jinseong photo

Park, Jinseong
COLLEGE OF ENGINEERING (SCHOOL OF MATERIALS SCIENCE AND ENGINEERING)
Read more

Altmetrics

Total Views & Downloads

BROWSE