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Control of Adhesion Force Between Ceria Particles and Polishing Pad in Shallow Trench Isolation Chemical Mechanical Planarization Go to Link

Seo, Jihoon; Moon, Jinok; Bae, Jae-Young; Yoon, Kwang Seob; Sigmund, Wolfgang; Paik, Ungyu

ArticleIssue Date2014CitationJournal of Nanoscience and Nanotechnology, v.14, no.6, pp 4351 - 4356PublisherAmerican Scientific Publishers

SCIESCOPUS

Dishing-free chemical mechanical planarization for copper films Go to Link

Yun, Sang-Su; Son, Young-Hye; Jeong, Gi-ppeum; Lee, Je-hwan; Jeong, Jong-han; Bae, Jae-Young; Kim, Sung-In; Park, Jin-Hyung; Park, Jea Gun

ArticleIssue Date2021CitationColloids and Surfaces A: Physicochemical and Engineering Aspects, v.616, pp.1 - 15PublisherElsevier B.V.

SCIESCOPUS

Enhancement of Collection Efficiency of an Inertial Impactor Using an Additional Punched Impaction Plate Go to Link

Cheon, Tae-Won; Lee, Jong-Yeol; Bae, Jae-Young; Yook, Se-Jin

ArticleIssue Date2017CitationAerosol and Air Quality Research, v.17, no.10, pp 2349 - 2357PublisherChinese Association for Aerosol Research in Taiwan

SCIESCOPUS

Influence of Scavenger on Abrasive Stability Enhancement and Chemical and Mechanical Properties for Tungsten-Film Chemical- Mechanical-Planarization Go to Link

Seo, Eun-Bin; Bae, Jae-Young; Kim, Sung-In; Choi, Han-Eol; Kim, Pilsu; Lee, Jong-Chan; Son, Young-Hye; Yun, Sang-Su; Park, Jin-Hyung; Park, Jea Gun

ArticleIssue Date2020CitationECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, v.9, no.6, pp.1 - 7PublisherELECTROCHEMICAL SOC INC

SCIESCOPUS

Nitridated TiO2 hollow nanofibers as an anode material for high power lithium ion batteries Go to Link

Han, Hyungkyu; Song, Taeseup; Bae, Jae-Young; Nazar, Linda F.; Kim, Hansu; Paik, Ungyu

ArticleIssue Date2011CitationEnergy & Environmental Science, v.4, no.11, pp 4532 - 4536PublisherRoyal Society of Chemistry

SCOPUS

Relationship between spatial wavelength pad surface profile and pattern step-height reduction with 28 nm ceria particle slurry Go to Link

Moon, Jinok; Bae, Jae-Young; Seo, Jihoon; Paik, Ungyu

ArticleIssue Date2012CitationICPT 2012 - International Conference on Planarization/CMP Technology, Proceedings, pp.209 - 214PublisherVDE Verlag GmbH

SCIESCOPUS

Silicon Wafer CMP Slurry Using a Hydrolysis Reaction Accelerator with an Amine Functional Group Remarkably Enhances Polishing Rate Go to Link open access

Bae, Jae-Young; Han, Man-Hyup; Lee, Seung-Jae; Kim, Eun-Seong; 이경식; Lee, Gon-Sub; Park, Jin-Hyung; Park, Jea-Gun

ArticleIssue Date2022CitationNANOMATERIALS, v.12, no.21, pp 1 - 13PublisherMDPI

SCIESCOPUS

Surface-Tensile-Stress Induced Polishing-Voids Suppression via H2O2 Oxidizer Effect in Cross-Point Phase-Change-Memory-Cells Go to Link open access

Kim, Soo-Bum; Cui, Hao; Cho, Jong-Young; Seo, Eun-Bin; Yun, Sang-Su; Son, Young-Hye; Jeong, Gi-Ppeum; Bae, Jae-Young; Park, Jin-Hyung; Kang, Sung-Goon, et al.

ArticleIssue Date2019CitationECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, v.8, no.11, pp.P667 - P672PublisherELECTROCHEMICAL SOC INC

SCIESCOPUS

Y Super fine cerium hydroxide abrasives for-SiO2 film chemical mechanical planarization performing scratch free Go to Link open access

Son, Young-Hye; Jeong, Gi-Ppeum; Kim, Pil-Su; Han, Man-Hyup; Hong, Seong-Wan; Bae, Jae-Young; Kim, Sung-In; Park, Jin-Hyung; Park, Jea-Gun

ArticleIssue Date2021CitationScientific Reports, v.11, no.1, pp.1 - 10PublisherNATURE PORTFOLIO

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Browsing by Bae, Jae-YoungAuthor

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