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SCIESCOPUS
Effect of alkaline agent on polishing rate of nitrogen-doped Ge2Sb2Te5 film in chemical mechanical polishingGo to Link

Park, Jin-Hyung; Cho, Jong-Young; Hwang, Hee-Sub; Paik, Ungyu; Park, Jea-Gun

ArticleIssue Date2007CitationElectrochemical and Solid-State Letters, v.11, no.10, pp H288 - H291PublisherElectrochemical Society, Inc.
SCOPUS
Effect of alkaline agent with organic additive in colloidal silica slurry on polishing rate selectivity of polysilicon-to-SiO2 in polysilicon CMPGo to Link

Hwang, Hee-Sub; Kang, Hyun-Goo; Park, Jin-Hyung; Paik, Ungyu; Park, Hyung-Soon; Park, Jea-Gun

ArticleIssue Date2008CitationECS Transactions, v.13, no.4, pp 67 - 73PublisherElectrochemical Society, Inc.
SCIESCOPUS
Effect of beta-cyclodextrin and Citric Acid on Chemical Mechanical Polishing of Polycrystalline Ge2Sb2Te5 in H2O2 Containing SlurryGo to Link

Cho, Jong-Young; Hwang, Hee-Sub; Woo, Sang-Hwa; Park, Jin-Hyung; Hwang, Eung-Rim; Kang, Sung-Goon; Park, Jea-Gun

ArticleIssue Date2013CitationECS Journal of Solid State Science and Technology, v.2, no.7, pp P299 - P304PublisherElectrochemical Society, Inc.
SCISCIESCOPUS
Effect of Hydroxyethyl Cellulose Concentration on Surface Qualities of Silicon Wafer after Touch Polishing ProcessGo to Link

Hwang, Hee-Sub; Lim, Jae-Hyung; Park, Jin-Hyung; Choi, Eun-Suck; Ahn, Jin-Woo; Park, Jea-Gun

ArticleIssue Date2010CitationElectrochemical and Solid-State Letters, v.13, no.5, pp H147 - H150PublisherElectrochemical Society, Inc.
SCISCIESCOPUS
Effect of NH4OH Concentration on Surface Qualities of a Silicon Wafer after Final-Touch PolishingGo to Link

Hwang, Hee-Sub; Park, Jin-Hyung; Choi, Eun-Suck; Ahn, Jin-Woo; Park, Jea-Gun

ArticleIssue Date2011CitationJournal of the Electrochemical Society, v.158, no.6, pp H641 - H644PublisherElectrochemical Society, Inc.
SCISCIESCOPUS
Effect of Organic Additive on Surface Roughness of Polycrystalline Silicon Film after Chemical Mechanical PolishingGo to Link

Hwang, Hee-Sub; Park, Jin-Hyung; Yi, Sok-Ho; Paik, Ungyu; Park, Jea-Gun

ArticleIssue Date2010CitationJapanese Journal of Applied Physics, v.49, no.1, pp 1 - 3PublisherIOP Publishing Ltd
SCOPUS
Effect of organic amine in colloidal silica slurry on polishing-rate selectivity of copper to tantalum-nitride film in copper chemical mechanical planarizationGo to Link

Park, Jin-Hyung; Cui, Hao; Hwang, Hee-Sub; Paik, Ungyu; Park, Hyung-Soon; Park, Jea-Gun

ArticleIssue Date2008CitationECS Transactions, v.13, no.4, pp 51 - 57PublisherElectrochemical Society, Inc.
SCISCIESCOPUS
Influences of Organic Additive Molecular Weight in Colloidal-Silica-Based Slurry on Final Polishing Characteristics of Silicon WaferGo to Link

Moon, Byeong-Sam; Hwang, Hee-Sub; Park, Jea-Gun

ArticleIssue Date2012CitationJournal of the Electrochemical Society, v.159, no.2, pp H107 - H111PublisherElectrochemical Society, Inc.
SCISCIESCOPUS
Multiselectivity Chemical Mechanical Polishing for NAND Flash Memories beyond 32 nmGo to Link

Park, Jin-Hyung; Cui, Hao; Cho, Jong-Young; Hwang, Hee-Sub; Hwang, Woong-Jun; Paik, Ungyu; Kang, Hyun-Goo; Kwak, Noh-Jung; Park, Jea-Gun

ArticleIssue Date2010CitationJournal of the Electrochemical Society, v.157, no.6, pp H607 - H612PublisherElectrochemical Society, Inc.
SCISCIESCOPUS
Potassium Permanganate as Oxidizer in Alkaline Slurry for Chemical Mechanical Planarization of Nitrogen-doped Polycrystalline Ge2Sb2Te5 FilmGo to Link

Cui, Hao; Cho, Jong-Young; Hwang, Hee-Sub; Lim, Jae-Hyung; Park, Jin-Hyung; Park, Hyung Soon; Hong, Kwon; Park, Jea-Gun

ArticleIssue Date2010CitationJournal of the Electrochemical Society, v.157, no.11, pp H1036 - H1041PublisherElectrochemical Society, Inc.
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