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Corrosion Lifetime Estimation of Printed Circuit Board in Marine Atmosphere Environment Using Multiphysics Simulation Go to Link

Kim, Sang-Il; Kim, Dug-Joong; Kim, Do-Hyung; Jang, Dong-Min; Jang, Jin-Woo; Lee, Seung-Yeong; Kim, Hak-Sung

ArticleIssue Date2023CitationINTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING-GREEN TECHNOLOGY, v.10, no.3, pp 789 - 805PublisherKOREAN SOC PRECISION ENG

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Determination of Fatigue Model Constants for Bi-Based SAC305 Hybrid Solder Joint Go to Link

Jang, Yongrae; Kim, You-Gwon; Kim, Hak-Sung; Kim, Do-Hyung; Jang, Dong-Min; Jang, Jin-Woo; Lee, Seung-Yeong; Han, Bongtae

ArticleIssue Date2025CitationIEEE Transactions on Components, Packaging and Manufacturing Technology, v.15, no.10, pp 2152 - 2159PublisherInstitute of Electrical and Electronics Engineers Inc.

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Prediction of fatigue life of semiconductor package under thermal cycling: Combined effect of package design and solder materials Go to Link open access

Kim, Heon-Su; Kim, You-Gwon; Jang, Dong-Min; Jang, Jin-Woo; Lee, Seung-Yeong; Kim, Hak-Sung

ArticleIssue Date2025CitationMaterials & Design, v.254, pp 1 - 11PublisherElsevier BV

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Browsing by Jang, Dong-MinAuthor

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