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SCIESCOPUS
50% reduction in energy consumption in an actual cold storage facility using a deep reinforcement learning-based control algorithmGo to Link

Park, Jong-Whi; Ju, Young-Min; Kim, You-Gwon; Kim, Hak-Sung

ArticleIssue Date2023CitationApplied Energy, v.352, pp 1 - 12PublisherElsevier Ltd
SCOPUS
Advanced Bonding Process based on Intense Pulsed Light Irradiation for Solder Bump in Flip-Chip Package

Ryu, Seong-Ung; Park, Jong-Whi; Ju, Young-Min; Kim, Hak-Sung

ArticleIssue Date2024CitationProceedings - Electronic Components and Technology Conference, pp 2218 - 2222
SCIESCOPUSKCI
Advanced WBG power semiconductor packaging: nanomaterials and nanotechnologies for high-performance die attach pasteGo to Linkopen access

Ju, Young-Min; Kim, Tae-Wan; Lee, Seung-Hyun; Lee, Ho-Jin; Ahn, Jinho; Kim, Hak-Sung

ArticleIssue Date2025CitationNANO CONVERGENCE, v.12, no.1, pp 1 - 53PublisherSPRINGER
SCOPUSESCI
Enhancing cold storage efficiency: Continuous deep deterministic policy gradient approach to energy optimization utilizing strategic sensor input dataopen access

Park, Jong-Whi; Ju, Young-Min; Kim, Hak-Sung

ArticleIssue Date2025CitationEnergy Conversion and Management: X, v.26, pp 1 - 11PublisherElsevier Ltd
SCIESCOPUSKCI
Intense Pulsed Light Welding Process with Mechanical Roll-Pressing for Highly Conductive Silver Nanowire Transparent ElectrodeGo to Link

Ju, Young-Min; Park, Jong-Whi; Jang, Yong-Rae; Park, Simon S.; Kim, Hak Sung

ArticleIssue Date2023CitationInternational Journal of Precision Engineering and Manufacturing - Green Technology, v.11, no.1, pp 1 - 17PublisherKorean Society for Precision Engineeing
SCOPUSESCI
Measurement of interfacial adhesion strength of Copper-Silicon based dielectric interfaces via laser spallation testGo to Linkopen access

Ju, Young-Min; Kim, Dukyong; Lee, Se-Min; Kim, Heuisu; Lee, Daewoong; Hwang, Yeon-Taek; Lee, Seung Hwan; Kim, Hak-Sung

ArticleIssue Date2025CitationApplied Surface Science Advances, v.28, pp 1 - 12PublisherElsevier
SCOPUS
Measurement of the interfacial strength of thin metal film by laser spallation method for advanced wafer level package

Ju, Young-Min; Um, Hui-Jin; Lee, Se-Min; Kim, Dukyong; Yoo, Woong-Kyoo; Lee, Daewoong; Hwang, Yeontaek; Lee, Seung Hwan; Kim, Hak-Sung

ArticleIssue Date2024CitationProceedings - Electronic Components and Technology Conference, pp 1260 - 1264
SCIESCOPUS
Non-vacuum room temperature-processed sintering method of molybdenum pattern by intense pulsed light irradiation for high-performance electronic devicesGo to Link

Moon, Chang-Jin; Park, Jong-Whi; Jang, Yong-Rae; Ju, Young-Min; Kim, Hak-Sung

ArticleIssue Date2022CitationThin Solid Films, v.759, pp 1 - 8PublisherElsevier B.V.
SCIESCOPUS
Reduced warpage in semiconductor packages: Optimizing post-cure temperature profile considering cure shrinkage and viscoelasticity of epoxy molding compoundGo to Linkopen access

Um, Hui-Jin; Ju, Young-Min; Lee, Dae-Woong; Ahn, Jinho; Kim, Hak-Sung

ArticleIssue Date2024CitationMaterials & Design, v.245, pp 1 - 13PublisherElsevier Ltd
SCIESCOPUS
Ultra-Millisecond Flip-Chip Bonding Process via Intense Pulsed Light IrradiationGo to Link

Ju, Young-Min; Ryu, Seong-Ung; Park, Jong-Whi; Kim, Hak-Sung

ArticleIssue Date2025CitationACS Applied Materials & Interfaces, v.17, no.27, pp 39694 - 39707PublisherAmerican Chemical Society
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