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Low temperature and ion-cut based monolithic 3D process integration platform incorporated with CMOS, RRAM and photo-sensor circuitsGo to Link

Han, Hoonhee; Choi, Rino; Jung, Seong-Ook; Chung, Sung Woo; Cho, Byung Jin; Song, Sheng-Chi; Choi, Changhwan

ArticleIssue Date2020Citation2020 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), v.2020-December, pp.15.6.1 - 15.6.4PublisherIEEE
SCIESCOPUS
Vertically Integrated In-Sensor Processing System Based on Three-Dimensional Reservoir for Artificial Tactile SystemGo to Link

Jung, Taeseung; Kim, Dohan; Kim, Giuk; Kim, Seungyeob; Choi, Hyojun; Jo, Minyoung; Kim, Yunjeong; Ahn, Jinho; Jung, Seong-Ook; Jeon, Sanghun

ArticleIssue Date2025CitationEnergy & Environmental Materials, v.8, no.6, pp 1 - 11PublisherWILEY
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