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전체 가 나 다 라 마 바 사 아 자 차 카 타 파 하

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Anisotropic viscoelastic shell modeling technique of copper patterns/photoimageable solder resist composite for warpage simulation of multi-layer printed circuit boards

Kim, Do-Hyoung; Joo, Sung-Jun; Kwak, Dong-Ok; Kim, Hak-Sung

ArticleIssue Date2015CitationJournal of Micromechanics and Microengineering, v.25, no.10, pp 1 - 12PublisherInstitute of Physics Publishing
SCIESCOPUS
Bi-directional homogenization equivalent modeling for the prediction of thermo-mechanical properties of a multi-layered printed circuit board (PCB)Go to Link

Joo, Sung-Jun; Park, Buhm; Kim, Do-Hyoung; Kwak, Dong-Ok; Park, Junhong; Kim, Hak-Sung

ArticleIssue Date2016CitationJournal of Micromechanics and Microengineering, v.26, no.4, pp 1 - 15PublisherInstitute of Physics Publishing
SCIESCOPUS
Investigation of multilayer printed circuit board (PCB) film warpage using viscoelastic properties measured by a vibration test

Joo, Sung-Jun; Park, Buhm; Kim, Do-Hyoung; Kwak, Dong-Ok; Song, In-Sang; Park, Junhong; Kim, Hak-Sung

ArticleIssue Date2015CitationJournal of Micromechanics and Microengineering, v.25, no.3, pp 1 - 9PublisherInstitute of Physics Publishing
SCIESCOPUS
Warpage Simulation of a Multilayer Printed Circuit Board and Microelectronic Package Using the Anisotropic Viscoelastic Shell Modeling Technique That Considers the Initial Warpage

Kim, Do-Hyoung; Joo, Sung-Jun; Kwak, Dong-Ok; Kim, Hak-Sung

ArticleIssue Date2016CitationIEEE Transactions on Components, Packaging and Manufacturing Technology, v.6, no.11, pp 1667 - 1676PublisherInstitute of Electrical and Electronics Engineers Inc.
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