Anisotropic viscoelastic shell modeling technique of copper patterns/photoimageable solder resist composite for warpage simulation of multi-layer printed circuit boards
- Authors
- Kim, Do-Hyoung; Joo, Sung-Jun; Kwak, Dong-Ok; Kim, Hak-Sung
- Issue Date
- Oct-2015
- Publisher
- IOP PUBLISHING LTD
- Keywords
- printed circuit board (PCB); warpage simulation; viscoelastic property; anisotropic shell model
- Citation
- JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.25, no.10, pp.1 - 12
- Indexed
- SCIE
SCOPUS
- Journal Title
- JOURNAL OF MICROMECHANICS AND MICROENGINEERING
- Volume
- 25
- Number
- 10
- Start Page
- 1
- End Page
- 12
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/24837
- DOI
- 10.1088/0960-1317/25/10/105016
- ISSN
- 0960-1317
- Abstract
- In this study, the warpage simulation of a multi-layer printed circuit board (PCB) was performed as a function of various copper (Cu) patterns/photoimageable solder resist (PSR) composite patterns and their anisotropic viscoelastic properties. The thermo-mechanical properties of Cu/PSR patterns were obtained from finite element analysis (virtual test) and homogenized with anisotropic composite shell models that considered the viscoelastic properties. The multi-layer PCB model was simplified based on the unit Cu/PSR patterns and the warpage simulation during the reflow process was performed by using ABAQUS combined with a user-defined subroutine. From these results, it was demonstrated that the proposed anisotropic viscoelastic composite shell simulation technique can be successfully used to predict warpage of multi-layer PCBs during the reflow process.
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