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Effect of (Ni, Au)(3)Sn-4 growth on the thermal resistance of Au-20 wt% Sn solder/ENIG joint in flip-chip LED packages Go to Link

Lee, Tae-Young; Kang, Min-Su; Yoo, Sehoon; Kim, Young-Ho; Kim, Min-Su

ArticleIssue Date2020CitationJapanese Journal of Applied Physics, v.59, pp 1 - 6PublisherIOP Publishing Ltd

SCIESCOPUS

Epoxy/silane pre-synthesis improving thermal properties and adhesion strength of silica-filled non-conductive adhesive for fine-pitch thermocompression bonding Go to Link

Lee, Tae-Young; Kim, Min-Su; Ko, Yong-Ho; Kim, Young-Ho; Yoo, Sehoon

ArticleIssue Date2020CitationJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.31, no.2, pp.1227 - 1235PublisherSPRINGER

SCIESCOPUS

Joint properties and reliability of Cu/Sn-Ag pillar bumps via low-temperature thermo-compression bonding Go to Link

Park, Jae-Yong; Lee, Ja Yeon; Park, Hwan-Pil; Kim, Sung-Chul; Lee, Tae-Young; Yoo, Sehoon; Kim, Young-Ho

ArticleIssue Date2019CitationMICROELECTRONIC ENGINEERING, v.216, pp.1 - 7PublisherELSEVIER

SCISCIESCOPUS

The effect of solder wetting on nonconductive adhesive (NCA) trapping in NCA applied flip-chip bonding Go to Link

Kim, Sun-Chul; Lee, Ja Yeon; Park, Jae-Yong; Lee, Tae-Young; Kim, Young-Ho

ArticleIssue Date2016CitationJournal of Materials Science: Materials in Electronics, v.27, no.7, pp 6646 - 6655PublisherKluwer Academic Publishers

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Browsing by Lee, Tae-YoungAuthor

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