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3D printed continuous carbon fiber reinforced thermoplastic composite sandwich structure with corrugated core for high stiffness/load capability Go to Link

Um, Hui-Jin; Lee, Ji-Seok; Shin, Ji-Hwan; Kim, Hak-Sung

ArticleIssue Date2022CitationCOMPOSITE STRUCTURES, v.291, pp 1 - 8PublisherELSEVIER SCI LTD

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3D-Printable toe-joint design of prosthetic foot Go to Link

Um, Hui-Jin; Kim, Heon-Su; Hong, Woolim; Kim, Hak-Sung; Hur, Pilwon

ArticleIssue Date2021Citation2021 18th International Conference on Ubiquitous Robots, UR 2021, pp.9 - 13PublisherInstitute of Electrical and Electronics Engineers Inc.

SCIESCOPUS

Design of 3D printable prosthetic foot to implement nonlinear stiffness behavior of human toe joint based on finite element analysis Go to Link open access

Um, Hui-Jin; Kim, Heon-Su; Hong, Woolim; Kim, Hak-Sung; Hur, Pilwon

ArticleIssue Date2021CitationSCIENTIFIC REPORTS, v.11, no.1, pp.1 - 11PublisherNATURE PORTFOLIO

SCOPUS

DEVELOPMENT OF ELECTRIC VEHICLE UNDERBODY SHIELD USING CARBON FIBER/POLY(ETHYLENE TEREPHTHALATE) AND SELF REINFORCED POLYPROPYLENE COMPOSITES

Um, Hui-Jin; Kim, Hak Sung

ArticleIssue Date2022CitationECCM 2022 - Proceedings of the 20th European Conference on Composite Materials: Composites Meet Sustainability, v.1, pp.233 - 240PublisherComposite Construction Laboratory (CCLab), Ecole Polytechnique Federale de Lausanne (EPFL)

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Empirical Validation of an Auxetic Structured Foot with the Powered Transfemoral Prosthesis Go to Link

Hong, Woolim; Kumar, Namita Anil; Patrick, Shawanee'; Um, Hui-Jin; Kim, Heon-Su; Kim, Hak Sung; Hur, Pilwon

ArticleIssue Date2022CitationProceedings of the IEEE RAS and EMBS International Conference on Biomedical Robotics and Biomechatronics, v.2022-August, pp 1 - 8PublisherIEEE Computer Society

SCIESCOPUS

Finite element analysis of moisture induced thermo-mechanical delamination of semiconductor packages considering in-situ moisture desorption during reflow process Go to Link

Hwang, Yeon-Taek; Um, Hui-Jin; Yu, Myeong-Hyeon; Lee, Dae-Woong; Lee, Mi-Jung; Kim, Hak Sung

ArticleIssue Date2021CitationMicroelectronics and Reliability, v.121, pp 1 - 13PublisherElsevier Ltd.

SCIESCOPUS

High-performance multifunctional energy storage-corrugated lattice core sandwich structure via continuous carbon fiber (CCF)/polyamide 6 (PA6) 3D printing Go to Link

Um, Hui-Jin; Jeon, Na-Hyun; Shin, Ji-Hwan; Kim, Hak-Sung

ArticleIssue Date2023CitationAdvanced Composites and Hybrid Materials, v.6, no.5, pp 1 - 18PublisherSpringer Science and Business Media B.V.

SCOPUS

Measurement of the interfacial strength of thin metal film by laser spallation method for advanced wafer level package

Ju, Young-Min; Um, Hui-Jin; Lee, Se-Min; Kim, Dukyong; Yoo, Woong-Kyoo; Lee, Daewoong; Hwang, Yeontaek; Lee, Seung Hwan; Kim, Hak-Sung

ArticleIssue Date2024CitationProceedings - Electronic Components and Technology Conference, pp 1260 - 1264

SCIESCOPUS

Mechanical performance of novel curved sandwich structures featuring 3D printed continuous carbon fiber/polyamide 6 composite corrugated core with rail interlocking Go to Link

Um, Hui-Jin; Rho, Hyun-Ji; Jeon, Na-Hyun; Shin, Ji-Hwan; Kim, Hak-Sung

ArticleIssue Date2025CitationComposites Part B: Engineering, v.295, pp 1 - 13PublisherPergamon Press Ltd.

SCIESCOPUS

Mixed mode fracture toughness of epoxy molding compound/ printed circuit board interface of semiconductor packages with respect to temperature and moisture Go to Link

Um, Hui-Jin; Lee, Se-Min; Lee, Dae-Woong; Ha, Sangyul; Kim, Hak-Sung

ArticleIssue Date2023CitationEngineering Fracture Mechanics, v.289, pp 1 - 14PublisherPergamon Press Ltd.

SCIESCOPUS

Multi-scale progressive failure analysis of shear deformed woven fabric composites considering its pre-forming process Go to Link

Hwang, Yeon-Taek; Um, Hui-Jin; Kim, Hak-Sung

ArticleIssue Date2023CitationComposites Part A: Applied Science and Manufacturing, v.174, pp 1 - 11PublisherElsevier Ltd

SCIESCOPUS

Reduced warpage in semiconductor packages: Optimizing post-cure temperature profile considering cure shrinkage and viscoelasticity of epoxy molding compound Go to Link open access

Um, Hui-Jin; Ju, Young-Min; Lee, Dae-Woong; Ahn, Jinho; Kim, Hak-Sung

ArticleIssue Date2024CitationMaterials & Design, v.245, pp 1 - 13PublisherElsevier Ltd

SCIESCOPUS

Repeated impact behavior of multifunctional carbon fiber reinforced plastic composites sandwich structures with 3D printed novel rail interlocking core Go to Link

Rho, Hyun-ji; Um, Hui-Jin; Shin, Ji-hwan; Kim, Hak Sung

ArticleIssue Date2025CitationComposites Part A: Applied Science and Manufacturing, v.199, pp 1 - 14PublisherPergamon Press Ltd.

SCOPUS

Structural design for energy absorption during heel strike using the auxetic structure in the heel part of the prosthetic foot Go to Link

Kim, Heon-Su; Um, Hui-Jin; Hong, Woolim; Kim, Hak-Sung; Hur, Pilwon

ArticleIssue Date2021Citation2021 18th International Conference on Ubiquitous Robots, UR 2021, pp.130 - 133PublisherInstitute of Electrical and Electronics Engineers Inc.

SCOPUS

STUDY ON THE MECHANICAL BEHAVIORS OF 3D PRINTED HYBRID COMPOSITES WITH VARIOUS COMBINATION PATTERNS BETWEEN CARBON FIBER AND GLASS FIBER

Jeon, Na-Hyun; Um, Hui-Jin; Kim, Hak Sung

ArticleIssue Date2022CitationECCM 2022 - Proceedings of the 20th European Conference on Composite Materials: Composites Meet Sustainability, v.3, pp.17 - 24PublisherComposite Construction Laboratory (CCLab), Ecole Polytechnique Federale de Lausanne (EPFL)

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Browsing by Um, Hui-JinAuthor

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