ScholarWorks@Hanyang University: Browsing ScholarWorks

Browsing by Yoo, SehoonAuthor

All A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

전체 가 나 다 라 마 바 사 아 자 차 카 타 파 하

Sort by: In order: Results/Page Authors/Record:

Showing results 1 to 7 of 7

SCIESCOPUS

Effect of (Ni, Au)(3)Sn-4 growth on the thermal resistance of Au-20 wt% Sn solder/ENIG joint in flip-chip LED packages Go to Link

Lee, Tae-Young; Kang, Min-Su; Yoo, Sehoon; Kim, Young-Ho; Kim, Min-Su

ArticleIssue Date2020CitationJapanese Journal of Applied Physics, v.59, pp 1 - 6PublisherIOP Publishing Ltd

SCIESCOPUS

Effect of Cu electroplating parameters on microvoid formation and high-speed shear strength in Sn-3.0Ag-0.5Cu/Cu joints Go to Link

Park, Jae-Yong; Seo, Wonil; Yoo, Sehoon; Kim, Young-Ho

ArticleIssue Date2017CitationJournal of Alloys and Compounds, v.724, pp 492 - 500PublisherElsevier BV

SCISCIESCOPUS

Effect of Ni-P Plating Temperature on Growth of Interfacial Intermetallic Compound in Electroless Nickel Immersion Gold/Sn-Ag-Cu Solder Joints Go to Link

Seo, Wonil; Kim, Kyoung-Ho; Kim, Young-Ho; Yoo, Sehoon

ArticleIssue Date2018CitationJournal of Electronic Materials, v.47, no.1, pp 110 - 116PublisherInstitute of Electrical and Electronics Engineers

SCIESCOPUS

Electromigration reliability of Sn-3.0Ag-0.5Cu/Cu-Zn solder joints Go to Link

Park, Jae-Yong; Lee, Taeyoung; Seo, Wonil; Yoo, Sehoon; Kim, Young-Ho

ArticleIssue Date2019CitationJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.30, no.8, pp.7645 - 7653PublisherSPRINGER

SCIESCOPUS

Epoxy/silane pre-synthesis improving thermal properties and adhesion strength of silica-filled non-conductive adhesive for fine-pitch thermocompression bonding Go to Link

Lee, Tae-Young; Kim, Min-Su; Ko, Yong-Ho; Kim, Young-Ho; Yoo, Sehoon

ArticleIssue Date2020CitationJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.31, no.2, pp.1227 - 1235PublisherSPRINGER

SCIESCOPUS

Growth of intermetallic compounds and brittle fracture behavior of Sn-Ag-Cu/ENIG joint with columnar Ni-P layer Go to Link

Seo, Wonil; Kim, Min-Su; Ko, Yong-Ho; Kim, Young-Ho; Yoo, Sehoon

ArticleIssue Date2021CitationJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.32, no.1, pp.1042 - 1051PublisherSPRINGER

SCIESCOPUS

Joint properties and reliability of Cu/Sn-Ag pillar bumps via low-temperature thermo-compression bonding Go to Link

Park, Jae-Yong; Lee, Ja Yeon; Park, Hwan-Pil; Kim, Sung-Chul; Lee, Tae-Young; Yoo, Sehoon; Kim, Young-Ho

ArticleIssue Date2019CitationMICROELECTRONIC ENGINEERING, v.216, pp.1 - 7PublisherELSEVIER

RSS_1.0 RSS_2.0 ATOM_1.0

222, Wangsimni-ro, Seongdong-gu, Seoul, 04763, Korea+82-2-2220-1366

Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.

Browsing by Yoo, SehoonAuthor

BROWSE