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Low-Overhead Compressibility Prediction for High-Performance Lossless Data Compressionopen access

Authors
Kim, YoungilChoi, SeungdoLee, DaeyongJeong, JoonyongKwak, JaewookLee, JungkeolLee, GyeongyongLee, SangjinPark, KibinJeong, JinwooKexin, WangSong, Yong Ho
Issue Date
Feb-2020
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Keywords
Data compression; Huffman coding; LZ77 encoding; accelerator architecture; field programmable gate array; estimation; compressibility
Citation
IEEE ACCESS, v.8, pp.37105 - 37123
Indexed
SCIE
SCOPUS
Journal Title
IEEE ACCESS
Volume
8
Start Page
37105
End Page
37123
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/10733
DOI
10.1109/ACCESS.2020.2975929
Abstract
As big data has evolved over the past few years, a lack of storage space and I/O bandwidth has become one of the most important challenges to overcome. To mitigate these problems, data compression schemes reduce the amount of data to be stored and transmitted at the cost of additional CPU overhead. Many researchers have attempted to reduce the computational load imposed on the CPU by data compression using specialized hardware. However, space savings through data compression often comes from only a small portion of data. Therefore, compressing all data, regardless of data compressibility, can waste computational resources. Our work aims to decrease the cost of data compression by introducing a selective data compression scheme based on data compressibility prediction. The proposed compressibility prediction method provides more fine-grained selectivity for combinational compression. Additionally, our method reduces the amount of resources consumed by the compressibility predictor, enabling selective compression at a low cost. To verify the proposed scheme, we implemented a DEFLATE compression system on a field-programmable gate array platform. Experimental results demonstrate that the proposed scheme improves compression throughput by 34.15% with a negligible decrease in compression ratio.
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서울 공과대학 (서울 융합전자공학부)
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