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Utilized solder spalling for de-bonding process in Fan-Out Wafer Level Package
- Authors
- 김영호
- Issue Date
- 23-Nov-2019
- Publisher
- Institute for Materials Research, TOHOKU UNIVERSITY
- Citation
- 11th Korea-Japan Berkeley Symposium on Advanced Materials
- Conference Name
- 11th Korea-Japan Berkeley Symposium on Advanced Materials
- Place
- The Hokkaido University Tokyo Office
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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