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Effects of Cu insertion layer on bipolar resistive switching in oxygenated amorphous carbon layer

Authors
홍진표
Issue Date
19-Nov-2019
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/11346
Place
한양대 종합기술원(HIT관) 6층
Conference Name
반도체/디스플레이 스마트 공정을 위한 소재/부품/장비 혁신 기술
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서울 자연과학대학 > 서울 물리학과 > 2. Conference Papers

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