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Electromagnetic interference shielding effect of double layer copper patterns with moisture ventilation at package level
- Authors
- 김영호
- Issue Date
- 15-Nov-2019
- Publisher
- The Korean Microelectronics and Packaging Society
- Citation
- The 18th International symposium on Microelectronics and Packaging jointed with the 21st International Conference on Electronic Materials and Packaging
- Conference Name
- The 18th International symposium on Microelectronics and Packaging jointed with the 21st International Conference on Electronic Materials and Packaging
- Place
- Hotel Aqua Palace, Busan, Korea
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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