Polymer link breakage of polyimide-film-surface using hydrolysis reaction accelerator for enhancing chemical-mechanical-planarization polishing-rate
DC Field | Value | Language |
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dc.contributor.author | Jeong, Gi-Ppeum | - |
dc.contributor.author | Park, Jun-Seong | - |
dc.contributor.author | Lee, Seung-Jae | - |
dc.contributor.author | Kim, Pil-Su | - |
dc.contributor.author | Han, Man-Hyup | - |
dc.contributor.author | Hong, Seong-Wan | - |
dc.contributor.author | Kim, Eun-Seong | - |
dc.contributor.author | Park, Jin-Hyung | - |
dc.contributor.author | Choo, Byoung-Kwon | - |
dc.contributor.author | Kang, Seung-Bae | - |
dc.contributor.author | Park, Jea-Gun | - |
dc.date.accessioned | 2022-07-06T08:35:31Z | - |
dc.date.available | 2022-07-06T08:35:31Z | - |
dc.date.created | 2022-04-06 | - |
dc.date.issued | 2022-03 | - |
dc.identifier.issn | 2045-2322 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/139255 | - |
dc.description.abstract | In this study, the chemical decomposition of a polyimide-film (i.e., a PI-film)-surface into a soft-film-surface containing negatively charged pyromellitic dianhydride (PMDA) and neutral 4,4 '-oxydianiline (ODA) was successfully performed. The chemical decomposition was conducted by designing the slurry containing 350 nm colloidal silica abrasive and small molecules with amine functional groups (i.e., ethylenediamine: EDA) for chemical-mechanical planarization (CMP). This chemical decomposition was performed through two types of hydrolysis reactions, that is, a hydrolysis reaction between OH- ions or R-NH3+ (i.e., EDA with a positively charged amine groups) and oxygen atoms covalently bonded with pyromellitimide on the PI-film-surface. In particular, the degree of slurry adsorption of the PI-film-surface was determined by the EDA concentration in the slurry because of the presence of R-NH3+, that is, a higher EDA concentration resulted in a higher degree of slurry adsorption. In addition, during CMP, the chemical decomposition degree of the PI-film-surface was principally determined by the EDA concentration; that is, the degree of chemical composition was increased noticeably and linearly with the EDA concentration. Thus, the polishing-rate of the PI-film-surface increased notably with the EDA concentration in the CMP slurry. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | NATURE PORTFOLIO | - |
dc.title | Polymer link breakage of polyimide-film-surface using hydrolysis reaction accelerator for enhancing chemical-mechanical-planarization polishing-rate | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Park, Jea-Gun | - |
dc.identifier.doi | 10.1038/s41598-022-07340-y | - |
dc.identifier.scopusid | 2-s2.0-85125572804 | - |
dc.identifier.wosid | 000763010000020 | - |
dc.identifier.bibliographicCitation | SCIENTIFIC REPORTS, v.12, no.1, pp.1 - 10 | - |
dc.relation.isPartOf | SCIENTIFIC REPORTS | - |
dc.citation.title | SCIENTIFIC REPORTS | - |
dc.citation.volume | 12 | - |
dc.citation.number | 1 | - |
dc.citation.startPage | 1 | - |
dc.citation.endPage | 10 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | Y | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalWebOfScienceCategory | Multidisciplinary Sciences | - |
dc.subject.keywordPlus | DENSITY WIRING INTERPOSER | - |
dc.subject.keywordPlus | PHOTOSENSITIVE POLYIMIDE | - |
dc.subject.keywordPlus | SCATTERING | - |
dc.subject.keywordPlus | KINETICS | - |
dc.subject.keywordPlus | COATINGS | - |
dc.identifier.url | https://www.nature.com/articles/s41598-022-07340-y | - |
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