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반도체 패키지의 점탄성 특성을 고려한 휨 시뮬레이션A study on warpage simulation of microelectronic package with time-temperature dependent viscoelastic property
- Other Titles
- A study on warpage simulation of microelectronic package with time-temperature dependent viscoelastic property
- Issue Date
- Apr-2019
- Publisher
- 대한기계학회
- Citation
- 대한기계학회 재료 및 파괴부문 2019년도 춘계학술대회 논문집, pp.145 - 146
- Indexed
- OTHER
- Journal Title
- 대한기계학회 재료 및 파괴부문 2019년도 춘계학술대회 논문집
- Start Page
- 145
- End Page
- 146
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Collections - 서울 공과대학 > 서울 기계공학부 > 1. Journal Articles
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)