Ta thickness-dependent perpendicular magnetic anisotropy features in Ta/CoFeB/MgO/W free layer stacks
- Authors
- Yang, SeungMo; Lee, Jabin; An, GwangGuk; Kim, JaeHong; Chung, WooSeong; Hong, JinPyo
- Issue Date
- Jul-2015
- Publisher
- ELSEVIER SCIENCE SA
- Keywords
- Perpendicular magnetic anisotropy; Annealing stability; Ta thickness
- Citation
- THIN SOLID FILMS, v.587, pp.39 - 42
- Indexed
- SCIE
SCOPUS
- Journal Title
- THIN SOLID FILMS
- Volume
- 587
- Start Page
- 39
- End Page
- 42
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/142961
- DOI
- 10.1016/j.tsf.2014.11.068
- ISSN
- 0040-6090
- Abstract
- We describe Ta underlayer thickness influence on thermal stability of perpendicular magnetic anisotropy in Ta/CoFeB/MgO/W stacks. It is believed that thermal stability based on Ta underlay is associated with thermally-activated Ta atom diffusion during annealing. The difference in Ta thickness-dependent diffusion behaviors was confirmed with X-ray photoelectron spectroscopy analysis. Along with a feasible Ta thickness model, our observations suggest that an appropriate seed layer choice is needed for high temperature annealing stability, a critical issue in the memory industry. (C) 2014 Elsevier B.V. All rights reserved.
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