A study on the relationship between print-ability and flash light sinter-ability of Cu nano/micro-ink for printed electronics
- Authors
- Ryu, Chung-Hyeon; Moon, Chang-Jin; Kim, Hak-Sung
- Issue Date
- Feb-2019
- Publisher
- ELSEVIER SCIENCE SA
- Keywords
- Printed electronics; Flash light sintering; Cu nano/micro particle; Dispersion; Rheological property
- Citation
- THIN SOLID FILMS, v.671, pp.36 - 43
- Indexed
- SCIE
SCOPUS
- Journal Title
- THIN SOLID FILMS
- Volume
- 671
- Start Page
- 36
- End Page
- 43
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/15050
- DOI
- 10.1016/j.tsf.2018.12.021
- ISSN
- 0040-6090
- Abstract
- In this study, the effect of rheological properties of Cu nano/micro (NP/MP)-inks with various amounts of dispersant on the print-ability and sinter-ability for flash light sintering was investigated. The rheological properties such as viscosity, viscoelasticity and thixotropic index of Cu NP/MP-inks were measured using a rheometer. The fabricated Cu NP/MP-inks were printed on polyimide substrate using a screen printing method. The 3D profile of printed Cu NP/MP-ink pattern was measured using surface profiler. In order to sinter the printed Cu NP/MP-inks, flash light sintering technique was employed. The flash light irradiation conditions (pulse power, pulse number, on-time, and off-time) were optimized to obtain the high sintering characteristic of Cu NP/MP-inks. In order to characterize the microstructures and transformation crystal phase of the sintered Cu NP/MP-inks, scanning electron microscopy, focused ion-beam and X-ray diffraction analysis were performed. From the results, the optimal sintered Cu NP/MP-ink film had a 6.16 mu Omega.cm resistivity and 5B level of adhesion strength.
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