Roughening of Polyimide Surface for Inkjet Printing by Plasma Etching Using the Polyimide Masked with Polystyrene Nanosphere Array
- Authors
- Mun, Mu Kyeom; Park, Jin Woo; Ahn, Jin Ho; Kim, Ki Kang; Yeom, Geun Young
- Issue Date
- Oct-2015
- Publisher
- AMER SCIENTIFIC PUBLISHERS
- Keywords
- Polystyrene Nanosphere; Near-Atmospheric-Pressure Plasma; Surface Roughening; Polyimide; Ink Jet
- Citation
- JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.15, no.10, pp.8176 - 8182
- Indexed
- SCIE
SCOPUS
- Journal Title
- JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY
- Volume
- 15
- Number
- 10
- Start Page
- 8176
- End Page
- 8182
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/156262
- DOI
- 10.1166/jnn.2015.11285
- ISSN
- 1533-4880
- Abstract
- Two key conditions are required for the application of fine-line inkjet printing onto a flexible substrate such as polyimide (PI): linewidth control during the inkjetting process, and a strong adhesion of the polyimide surface to the ink after the ink solidifies. In this study, the properties of a polyimide surface that was roughened through etching in a He/SF6 plasma, using a polystyrene nanosphere array as the etch mask, were investigated. The near-atmospheric-pressure plasma system of the He/SF6 plasma that was used exhibits two notable properties in this context: similar to an atmospheric-pressure plasma system, it can easily handle inline substrate processing; and, similar to a vacuum system, it can control the process gas environment. Through the use of plasma etching, the polyimide surface masked the 120-nm-diameter polystyrene nanospheres, thereby forming a roughened nanoscale polyimide surface. This surface exhibited not only a greater hydrophobicity with a contact angle of about 150 for water and about 30 for silver ink, indicating better silver linewidth control during the silver inkjetting process but also a stronger adhesion to the silver ink sprayed onto it when compared with the flat polyimide surface.
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