Interpolymer complexes of poly(acrylic acid) and poly(ethylene glycol) for low dishing in STI CMP
- Authors
- Seo, Jihoon; Moon, Jinok; Moon, Sunho; Paik, Ungyu
- Issue Date
- Oct-2015
- Publisher
- ELSEVIER SCIENCE BV
- Keywords
- Passivation agent; PAA; PEG; Interpolymer complexes; Dishing; CMP
- Citation
- APPLIED SURFACE SCIENCE, v.353, pp.499 - 503
- Indexed
- SCIE
SCOPUS
- Journal Title
- APPLIED SURFACE SCIENCE
- Volume
- 353
- Start Page
- 499
- End Page
- 503
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/156296
- DOI
- 10.1016/j.apsusc.2015.06.078
- ISSN
- 0169-4332
- Abstract
- Although poly(acrylic acid) (PAA) has been used as a passivation agent for high polish rate selectivity between SiO2 and Si3N4 in STI CMP, it causes severe dishing during the over-polishing step. Here, we fabricated interpolymer complexes of PAA and poly(ethylene glycol) (PEG) as passivation agent for low dishing as well as high selectivity. PAA and PEG form a cross-linked network structure through H-bonding, which is called an "interpolymer complex". During the over-polishing step, the cross-linked network structure of the PAA-PEG interpolymer complex prevents abrasives from polishing SiO2 in the trenches, resulting in a significant decrease in dishing. These results provide researchers with a new approach toward passivation agents to provide low dishing in STI CMP.
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