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The Influence of Oxygen High-Pressure Annealing on the Performance and Bias Instability of Amorphous Ge-In-Ga-O Thin-Film Transistors

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dc.contributor.authorAhn, Byung Du-
dc.contributor.authorKim, Hyun-Suk-
dc.contributor.authorRim, You Seung-
dc.contributor.authorPark, Jin-Seong-
dc.contributor.authorKim, Hyun Jae-
dc.date.accessioned2022-07-16T01:33:16Z-
dc.date.available2022-07-16T01:33:16Z-
dc.date.issued2014-12-
dc.identifier.issn0018-9383-
dc.identifier.issn1557-9646-
dc.identifier.urihttps://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/158441-
dc.description.abstractThe effects of oxygen high-pressure annealing (O-2 HPA) on the performance and instability of amorphous Ge-In-Ga-O (a-GIGO) thin-film transistors (TFTs) were examined. The TFTs with HPA under 30 atm O-2 ambient exhibited consistently better stability against the applied temperature stress and positive gate bias stress. We demonstrate that the superior stability of the HPA-treated device can be correlated with the evolution of electronic structure in a-GIGO thin films, as measured by spectroscopic ellipsometry, which reveals the significantly reduced band edge states below the conduction band by the O-2 HPA treatment. Based on the Meyer-Neldel rule, the total density of subgap states energy distribution, including the interfacial and semiconductor bulk trap densities, was also extracted and compared, which can support the experimental observation.-
dc.format.extent5-
dc.language영어-
dc.language.isoENG-
dc.publisherInstitute of Electrical and Electronics Engineers-
dc.titleThe Influence of Oxygen High-Pressure Annealing on the Performance and Bias Instability of Amorphous Ge-In-Ga-O Thin-Film Transistors-
dc.typeArticle-
dc.publisher.location미국-
dc.identifier.doi10.1109/TED.2014.2359469-
dc.identifier.scopusid2-s2.0-84919468666-
dc.identifier.wosid000346573600028-
dc.identifier.bibliographicCitationIEEE Transactions on Electron Devices, v.61, no.12, pp 4132 - 4136-
dc.citation.titleIEEE Transactions on Electron Devices-
dc.citation.volume61-
dc.citation.number12-
dc.citation.startPage4132-
dc.citation.endPage4136-
dc.type.docTypeArticle-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClasssci-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaPhysics-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.subject.keywordPlusSTATES-
dc.subject.keywordAuthorAmorphous oxide semiconductor (AOS)-
dc.subject.keywordAuthorhigh-pressure annealing (HPA)-
dc.subject.keywordAuthorpositive-bias temperature stress (PBTS)-
dc.subject.keywordAuthorthin-film transistors (TFTs)-
dc.identifier.urlhttps://ieeexplore.ieee.org/document/6930753/-
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