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The Influence of Oxygen High-Pressure Annealing on the Performance and Bias Instability of Amorphous Ge-In-Ga-O Thin-Film Transistors

Authors
Ahn, Byung DuKim, Hyun-SukRim, You SeungPark, Jin-SeongKim, Hyun Jae
Issue Date
Dec-2014
Publisher
Institute of Electrical and Electronics Engineers
Keywords
Amorphous oxide semiconductor (AOS); high-pressure annealing (HPA); positive-bias temperature stress (PBTS); thin-film transistors (TFTs)
Citation
IEEE Transactions on Electron Devices, v.61, no.12, pp 4132 - 4136
Pages
5
Indexed
SCI
SCIE
SCOPUS
Journal Title
IEEE Transactions on Electron Devices
Volume
61
Number
12
Start Page
4132
End Page
4136
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/158441
DOI
10.1109/TED.2014.2359469
ISSN
0018-9383
1557-9646
Abstract
The effects of oxygen high-pressure annealing (O-2 HPA) on the performance and instability of amorphous Ge-In-Ga-O (a-GIGO) thin-film transistors (TFTs) were examined. The TFTs with HPA under 30 atm O-2 ambient exhibited consistently better stability against the applied temperature stress and positive gate bias stress. We demonstrate that the superior stability of the HPA-treated device can be correlated with the evolution of electronic structure in a-GIGO thin films, as measured by spectroscopic ellipsometry, which reveals the significantly reduced band edge states below the conduction band by the O-2 HPA treatment. Based on the Meyer-Neldel rule, the total density of subgap states energy distribution, including the interfacial and semiconductor bulk trap densities, was also extracted and compared, which can support the experimental observation.
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