The Influence of Oxygen High-Pressure Annealing on the Performance and Bias Instability of Amorphous Ge-In-Ga-O Thin-Film Transistors
- Authors
- Ahn, Byung Du; Kim, Hyun-Suk; Rim, You Seung; Park, Jin-Seong; Kim, Hyun Jae
- Issue Date
- Dec-2014
- Publisher
- Institute of Electrical and Electronics Engineers
- Keywords
- Amorphous oxide semiconductor (AOS); high-pressure annealing (HPA); positive-bias temperature stress (PBTS); thin-film transistors (TFTs)
- Citation
- IEEE Transactions on Electron Devices, v.61, no.12, pp 4132 - 4136
- Pages
- 5
- Indexed
- SCI
SCIE
SCOPUS
- Journal Title
- IEEE Transactions on Electron Devices
- Volume
- 61
- Number
- 12
- Start Page
- 4132
- End Page
- 4136
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/158441
- DOI
- 10.1109/TED.2014.2359469
- ISSN
- 0018-9383
1557-9646
- Abstract
- The effects of oxygen high-pressure annealing (O-2 HPA) on the performance and instability of amorphous Ge-In-Ga-O (a-GIGO) thin-film transistors (TFTs) were examined. The TFTs with HPA under 30 atm O-2 ambient exhibited consistently better stability against the applied temperature stress and positive gate bias stress. We demonstrate that the superior stability of the HPA-treated device can be correlated with the evolution of electronic structure in a-GIGO thin films, as measured by spectroscopic ellipsometry, which reveals the significantly reduced band edge states below the conduction band by the O-2 HPA treatment. Based on the Meyer-Neldel rule, the total density of subgap states energy distribution, including the interfacial and semiconductor bulk trap densities, was also extracted and compared, which can support the experimental observation.
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