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MTJ 버퍼층의 Ta/Ru 층의 두께 및 공정 온도 조건에 따른 Roughness에 대한 연구
- Authors
- 오영택; 최철민; 송윤흡; H. Sukegawa; S. Mitan
- Issue Date
- Jun-2014
- Publisher
- 대한전자공학회
- Citation
- 전자공학회논문지, v.37, no.1, pp.336 - 338
- Indexed
- OTHER
- Journal Title
- 전자공학회논문지
- Volume
- 37
- Number
- 1
- Start Page
- 336
- End Page
- 338
- ISSN
- 1016135X
- Abstract
- The roughness of MTJ has an effect on TMR and RA. We measured Ra, P-V, and RMS by using AFM, with varying the thickness of Ta and Ru in the Buffer Layer and process temperature condition so as to find a little better roughness condition. Furthermore, we present a direction for finding even better roughness condition.
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Collections - 서울 공과대학 > 서울 융합전자공학부 > 1. Journal Articles
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Related Researcher
- Song, Yun Heub
- COLLEGE OF ENGINEERING (SCHOOL OF ELECTRONIC ENGINEERING)