Al2O3 multi-density layer structure as a moisture permeation barrier deposited by radio frequency remote plasma atomic layer deposition
- Authors
- Jung, Hyunsoo; Jeon, Heeyoung; Choi, Hagyoung; Ham, Giyul; Shin, Seokyoon; Jeon, Hyeongtag
- Issue Date
- Feb-2014
- Publisher
- AMER INST PHYSICS
- Citation
- JOURNAL OF APPLIED PHYSICS, v.115, no.7, pp.1 - 8
- Indexed
- SCIE
SCOPUS
- Journal Title
- JOURNAL OF APPLIED PHYSICS
- Volume
- 115
- Number
- 7
- Start Page
- 1
- End Page
- 8
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/160775
- DOI
- 10.1063/1.4866001
- ISSN
- 0021-8979
- Abstract
- Al2O3 films deposited by remote plasma atomic layer deposition have been used for thin film encapsulation of organic light emitting diode. In this study, a multi-density layer structure consisting of two Al2O3 layers with different densities are deposited with different deposition conditions of O-2 plasma reactant time. This structure improves moisture permeation barrier characteristics, as confirmed by a water vapor transmission rate (WVTR) test. The lowest WVTR of the multi-density layer structure was 4.7 x 10(-5) gm(-2) day(-1), which is one order of magnitude less than WVTR for the reference single-density Al2O3 layer. This improvement is attributed to the location mismatch of paths for atmospheric gases, such as O-2 and H2O, in the film due to different densities in the layers. This mechanism is analyzed by high resolution transmission electron microscopy, elastic recoil detection, and angle resolved X-ray photoelectron spectroscopy. These results confirmed that the multi-density layer structure exhibits very good characteristics as an encapsulation layer via location mismatch of paths for H2O and O-2 between the two layers.
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