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A 80x60 Micro-Bolometer CMOS Thermal Imager Integrated with a Low-Noise 12-Bit DAC

Authors
Kim, Ki-DukPark, SeunghyunLee, ByunghunLee, Hyung-MinCho, Gyu-Hyeong
Issue Date
Aug-2022
Publisher
Institute of Electrical and Electronics Engineers
Keywords
Calibration; CMOS thermal imager; Computer architecture; Digital-to-analog converter (DAC); Integrated circuits; Linearity; Micro-bolometer; Microprocessors; NETD; Thermal noise; Voltage measurement
Citation
IEEE Transactions on Industrial Electronics, v.69, no.8, pp 8604 - 8608
Pages
5
Indexed
SCIE
SCOPUS
Journal Title
IEEE Transactions on Industrial Electronics
Volume
69
Number
8
Start Page
8604
End Page
8608
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/170030
DOI
10.1109/TIE.2021.3109542
ISSN
0278-0046
1557-9948
Abstract
A low-cost 80x60 micro-bolometer CMOS thermal imager is presented. The imager system integrated with a proposed 12-bit biasing digital-to-analog converter (DAC) has 100 ms start-up time, which is 300x faster than commercial products, while ensuring comparable 100 mK noise-equivalent temperature difference (NETD). The low-noise biasing DAC adopts a current-mode divider- stacking structure and a bit-inversion technique, leading to mismatch-insensitive operation. The 12-bit biasing DAC in a 0.18 m CMOS imager IC has a low noise of 1.89 Vrms and INL/DNL of 0.14/0.09 LSB, respectively.
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COLLEGE OF ENGINEERING (서울 바이오메디컬공학전공)
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