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A new solder wetting layer for Pb-free solders
- Issue Date
- Feb-2009
- Publisher
- SPRINGER HEIDELBERG
- Citation
- JOURNAL OF MATERIALS RESEARCH, v.24, no.2, pp.297 - 300
- Indexed
- SCIE
SCOPUS
- Journal Title
- JOURNAL OF MATERIALS RESEARCH
- Volume
- 24
- Number
- 2
- Start Page
- 297
- End Page
- 300
- ISSN
- 0884-2914
- Abstract
- We developed a new Cu-Zn wetting layer for Pb-free solders. By adding Zn to the Cu wetting layer, intermetallic growth in the Sn-Ag-Cu (SAC) solder interfaces was delayed. Cu3Sn intermetallic compounds and microvoids were not observed ill the SAC/Cu-Zn interfaces after aging. The drop reliability of the SAC solder/Cu-Zn joints was excellent.
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