Crack suppression and residual stress in BaTiO3 based Ni-MLCCs of Y5V specification through post-process
- Authors
- Kang, Ji-Hun; Cha, Hyun-Min; Jung, Yeon-Gil; Paik, Ungyu
- Issue Date
- Aug-2008
- Publisher
- ELSEVIER SCIENCE SA
- Keywords
- BaTiO3; multilayer ceramic capacitors; (MLCCs); post-process; crack suppression; residual stress
- Citation
- JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, v.205, no.1-3, pp.160 - 167
- Indexed
- SCIE
SCOPUS
- Journal Title
- JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
- Volume
- 205
- Number
- 1-3
- Start Page
- 160
- End Page
- 167
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/178113
- DOI
- 10.1016/j.jmatprotec.2007.11.093
- ISSN
- 0924-0136
- Abstract
- The effects of an additional processing using pressure and heat treatment, that is, a "post -process", on crack suppression and residual stress are investigated in BaTiO3-based multilayer ceramic capacitors (MLCCs) with Y5V characteristics. At the planes (margins) parallel to the electrode, the crack length is dramatically reduced after the post-process in the direction parallel to the electrode, without a change in the direction perpendicular to the electrode. At the plane perpendicular to the electrode, the crack length is modestly reduced in both parallel and perpendicular directions. The post-process is effective in reducing the difference in crack length between directions at each plane. The residual tensile stresses induced at the planes of the MLCCs before the post-process are converted to the compressive stresses and the residual compressive stresses are enhanced through the post-process. The MLCCs after the post-process show the residual compressive stress of approximately 300 MPa throughout entire planes. (c) 2007 Elsevier B.V. All rights reserved.
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