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Patterning aluminum thin films by water-mediated nano-transfer printing

Authors
Lee, Byoung H.Sung, Myung M.Kim, Sang H.Lee, Ki-Dong
Issue Date
Dec-2007
Publisher
KOREAN PHYSICAL SOC
Keywords
Al metal patterning; soft lithography; solid bridge; liquid bridge
Citation
JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.51, pp.S203 - S206
Indexed
SCIE
SCOPUS
KCI
Journal Title
JOURNAL OF THE KOREAN PHYSICAL SOCIETY
Volume
51
Start Page
S203
End Page
S206
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/179254
DOI
10.3938/jkps.51.203
ISSN
0374-4884
Abstract
We report a new nano-transfer printing (nTP) method that uses a water-mediated transfer process. Water-mediated nTP is based on the direct transfer of a metal thin film from a stamp to a substrate via water-mediated surface bonding between the stamp and the substrate. This procedure can generate aluminum (Al) patterns with micrometer and nanometer-scale feature sizes. Furthermore, an array of Al nanochannels is fabricated by using this method. The transferred Al patterns chemically bound to the substrate surface and thus exhibit strong adhesion.
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