Preparation and thermo-mechanical properties of 4-component polyimide films
- Authors
- 서관식; 설경일; 김용석; 서동학; 최길영; 원종찬
- Issue Date
- Mar-2007
- Publisher
- POLYMER SOC KOREA
- Keywords
- polyimide; CTE; 4-component PI; 3-layered FCCL; adhesion
- Citation
- POLYMER-KOREA, v.31, no.2, pp.130 - 135
- Indexed
- SCIE
SCOPUS
KCI
- Journal Title
- POLYMER-KOREA
- Volume
- 31
- Number
- 2
- Start Page
- 130
- End Page
- 135
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/180371
- ISSN
- 0379-153X
- Abstract
- To enhance the thermo-mechanical properties of polyimide films which have potential application for the FCCL, we have synthesized the poly(amic acid)s composed of 4-components PMDA/BTDA and PDA/ODA as monomer system, and then they were effectively converted into 4-component polyimide films by thermal imidization process. It has been found that CTE values in the range of 100 similar to 200 degrees C dcreased with the amount of PDA, which also caused 36% and 59% increases in tensile modulus and strength respectively. And also. peel test results on 3-layered copper clad laminate using 4-component polyimide films showed excellent adhesion strength above 1.8 kgf/cm. On the basis of obtained results it can be concluded that 4-component polyimide films may be applied for the high performance FCCL base films.
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