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Preparation and thermo-mechanical properties of 4-component polyimide films

Authors
서관식설경일김용석서동학최길영원종찬
Issue Date
Mar-2007
Publisher
POLYMER SOC KOREA
Keywords
polyimide; CTE; 4-component PI; 3-layered FCCL; adhesion
Citation
POLYMER-KOREA, v.31, no.2, pp.130 - 135
Indexed
SCIE
SCOPUS
KCI
Journal Title
POLYMER-KOREA
Volume
31
Number
2
Start Page
130
End Page
135
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/180371
ISSN
0379-153X
Abstract
To enhance the thermo-mechanical properties of polyimide films which have potential application for the FCCL, we have synthesized the poly(amic acid)s composed of 4-components PMDA/BTDA and PDA/ODA as monomer system, and then they were effectively converted into 4-component polyimide films by thermal imidization process. It has been found that CTE values in the range of 100 similar to 200 degrees C dcreased with the amount of PDA, which also caused 36% and 59% increases in tensile modulus and strength respectively. And also. peel test results on 3-layered copper clad laminate using 4-component polyimide films showed excellent adhesion strength above 1.8 kgf/cm. On the basis of obtained results it can be concluded that 4-component polyimide films may be applied for the high performance FCCL base films.
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서울 공과대학 > 서울 화학공학과 > 1. Journal Articles

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