Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
Chip-on-glass bonding using sn bump and non-conductive adhesive for LCD application
- Authors
- Kim, Bae-Yong; Chen, Zhigang; Kim, Young-Ho
- Issue Date
- Nov-2006
- Publisher
- Taylor & Francis
- Keywords
- chip-on-glass (COG); non-conductive adhesive (NCA); Sn bump; thermal cycling
- Citation
- Molecular Crystals and Liquid Crystals, v.458, pp 199 - 206
- Pages
- 8
- Indexed
- SCIE
SCOPUS
- Journal Title
- Molecular Crystals and Liquid Crystals
- Volume
- 458
- Start Page
- 199
- End Page
- 206
- ISSN
- 1542-1406
1543-5318
- Abstract
- We developed a new chip-on-glass (COG) bonding method using non-conductive adhesive (NCA) and Sn bumps. The bonding was performed with various electrode pads on the glass substrate at 150 degrees C for 150 s under 100 MPa. The initial average contact resistance was 5.7m Omega for Au pad, 19.6m Omega for indium-tin oxide (ITO)/Au pad, 11.2m Omega for Al pad respectively. Thermal cycling test was performed in the temperature range between 0 degrees C and 100 degrees C. The contact resistance of the Sn bump-Au pad joints did not change even after 1000 cycles. In contrast, the joints formed on other type of pads failed electrically between 300 and 500 cycles.
- Files in This Item
- Go to Link
- Appears in
Collections - 서울 공과대학 > 서울 신소재공학부 > 1. Journal Articles
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.