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Effect of the hydroxyl-ethyl-cellulose concentration in a silicon wafer polishing slurry on the wafer surface roughness
- Authors
- Cho, Kyu-Chul; Jeon, Hyeongtag; Park, Jea-Gun
- Issue Date
- Apr-2006
- Publisher
- 한국물리학회
- Keywords
- wafer polishing; non-ionic surfactant; HEC; haze; roughness
- Citation
- Journal of the Korean Physical Society, v.48, no.4, pp L507 - L509
- Indexed
- SCIE
SCOPUS
KCI
- Journal Title
- Journal of the Korean Physical Society
- Volume
- 48
- Number
- 4
- Start Page
- L507
- End Page
- L509
- ISSN
- 0374-4884
1976-8524
- Abstract
- The purpose of this study was to reveal the mechanism of wafer touch polishing using a high-purity colloidal silica slurry containing organic surfactants such as hydroxyl-ethyl cellulose. The effect of the surfactant concentration on wafer touch polishing was studied to improve the roughness of wafer surfaces after polishing. The haze level and the micro-roughness decreased with decreasing surfactant concentration.
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Collections - 서울 공과대학 > 서울 신소재공학부 > 1. Journal Articles
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