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Improved properties of Pt-HfO2 gate insulator-ZnO semiconductor thin film structure by annealing of ZnO layer

Authors
Na, Kwang DukKim, Jeong HwanPark, Tae JooSong, JaewonHwang, Cheol SeongChoi, Jung-Hae
Issue Date
Jul-2010
Publisher
ELSEVIER SCIENCE SA
Keywords
Zinc oxide; Hafnium oxide; High-k dielectrics; Oxide semiconductor; Metal-insulator-semiconductor capacitor; Annealing; Sputtering; Atomic layer deposition
Citation
THIN SOLID FILMS, v.518, no.18, pp.5326 - 5330
Indexed
SCIE
SCOPUS
Journal Title
THIN SOLID FILMS
Volume
518
Number
18
Start Page
5326
End Page
5330
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/182046
DOI
10.1016/j.tsf.2010.04.004
ISSN
0040-6090
Abstract
Metal-insulator-semiconductor capacitors were fabricated with sputtered ZnO and atomic layer deposited HfO2 as the semiconductor and gate dielectric layers, respectively. From the capacitance-voltage measurements, it was confirmed that pre-deposition annealing of the sputtered ZnO layer at 300 degrees C in air greatly decreased the interfacial trap density (similar to 2 x 10(12) cm(-2) eV(-1)), X-ray photoelectron spectroscopy showed a decrease in the OH bonds adsorbed on the ZnO surface after pre-deposition annealing, which improved the interface property. A very small capacitance equivalent thickness of 1.3 nm was achieved, which decreased the operation voltage (<5V) of the device significantly. (C) 2010 Elsevier B.V. All rights reserved.
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