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Study on the mixed-mode delamination of epoxy mold compound (EMC)/printed circuit board(PCB) interface considering various temperature and moisture absorption
- Authors
- 김학성
- Issue Date
- 9-Nov-2022
- Place
- 부산, 한화 리조트
- Conference Name
- ISMP 2022 (International Symposium on Microelectronics and Packaging)
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)