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Prediction of Solder Fatigue Life of Package by Automated Parametric Modeling Simulation Technique
- Authors
- 김학성
- Issue Date
- 10-Nov-2022
- Place
- 부산, 한화 리조트
- Conference Name
- ISMP 2022 (International Symposium on Microelectronics and Packaging)
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)