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Warpage simulation with consideration of a cure shrinkage of EMC measured using FBG sensor and dielectric sensor

Authors
김학성
Issue Date
16-Nov-2022
Publisher
The Korean Society of Semiconductor & Display Technology
Citation
KISM 2022
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/183862
Conference Name
KISM 2022
Place
부산 파라다이스 호텔
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서울 공과대학 > 서울 기계공학부 > 2. Conference Papers

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Kim, Hak Sung
COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)
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