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Monolithic 3D Integration Process and Its Device Applications
- Authors
- 최창환
- Issue Date
- 7-Mar-2022
- Publisher
- IEEE
- Citation
- IEEE Electron Devices Technology and Manufacturing (EDTM)
- Conference Name
- IEEE Electron Devices Technology and Manufacturing (EDTM)
- Place
- Oita, Japan
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- There are no files associated with this item.
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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Related Researcher
- Choi, Chang hwan
- COLLEGE OF ENGINEERING (SCHOOL OF MATERIALS SCIENCE AND ENGINEERING)