STUDY ON CURE SHRINKAGE OF EMC USING DIELECTRIC SENSOR AND FBG SENSOR

Abstract

The curing status and internal strain of epoxy molding compound (EMC) were monitored using a dielectric sensor and a fiber Bragg grating (FBG) sensor under curing conditions similar to the actual semiconductor packaging process. The dissipation factor was measured with a dielectric sensor during the molding process, and a gelation point, which is the starting point of effective cure shrinkage, was defined. Also, differential scanning calorimetry (DSC) test and rheometer test were performed and analyzed with dielectrometry measurement. In addition, Bragg wavelength (BW) was measured with the FBG sensor during the whole curing process and the cure shrinkage of the EMC was obtained. From these results, the effective cure shrinkage of the EMC that actually affects the residual stress of the EMC after curing processing was obtained.