STUDY ON CURE SHRINKAGE OF EMC USING DIELECTRIC SENSOR AND FBG SENSOR
- Authors
- Baek, Jeong-Hyeon; Park, Dong-Woon; Park, Simon; Kim, Hak Sung
- Issue Date
- Jun-2022
- Publisher
- Composite Construction Laboratory (CCLab), Ecole Polytechnique Federale de Lausanne (EPFL)
- Keywords
- Cure shrinkage; Dielectric sensor; EMC; FBG sensor; Gelation point
- Citation
- ECCM 2022 - Proceedings of the 20th European Conference on Composite Materials: Composites Meet Sustainability, v.1, pp.1557 - 1564
- Indexed
- SCOPUS
- Journal Title
- ECCM 2022 - Proceedings of the 20th European Conference on Composite Materials: Composites Meet Sustainability
- Volume
- 1
- Start Page
- 1557
- End Page
- 1564
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/184837
- Abstract
- The curing status and internal strain of epoxy molding compound (EMC) were monitored using a dielectric sensor and a fiber Bragg grating (FBG) sensor under curing conditions similar to the actual semiconductor packaging process. The dissipation factor was measured with a dielectric sensor during the molding process, and a gelation point, which is the starting point of effective cure shrinkage, was defined. Also, differential scanning calorimetry (DSC) test and rheometer test were performed and analyzed with dielectrometry measurement. In addition, Bragg wavelength (BW) was measured with the FBG sensor during the whole curing process and the cure shrinkage of the EMC was obtained. From these results, the effective cure shrinkage of the EMC that actually affects the residual stress of the EMC after curing processing was obtained.
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - 서울 공과대학 > 서울 기계공학부 > 1. Journal Articles
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.