Wafer-recyclable, environment-friendly transfer printing for large-scale thin-film nanoelectronics
- Authors
- Wie, Dae Seung; Zhang, Yue; Kim, Min Ku; Kim, Bongjoong; Park, Sangwook; Kim, Young-Joon; Irazoqui, Pedro P.; Zheng, Xiaolin; Xu, Baoxing; Lee, Chi Hwan
- Issue Date
- Jul-2018
- Publisher
- NATL ACAD SCIENCES
- Keywords
- transfer printing method; thin-film nanoelectronics; Internet of Things; delaminationnondestructive wafer recycling
- Citation
- PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA, v.115, no.31, pp E7236 - E7244
- Indexed
- SCI
SCIE
SCOPUS
- Journal Title
- PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA
- Volume
- 115
- Number
- 31
- Start Page
- E7236
- End Page
- E7244
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/190816
- DOI
- 10.1073/pnas.1806640115
- ISSN
- 0027-8424
1091-6490
- Abstract
- Transfer printing of thin-film nanoelectronics from their fabrication wafer commonly requires chemical etching on the sacrifice of wafer but is also limited by defects with a low yield. Here, we introduce a wafer-recyclable, environment-friendly transfer printing process that enables the wafer-scale separation of high-performance thin-film nanoelectronics from their fabrication wafer in a defect-free manner that enables multiple reuses of the wafer. The interfacial delamination is enabled through a controllable cracking phenomenon in a water environment at room temperature. The physically liberated thin-film nanoelectronics can be then pasted onto arbitrary places of interest, thereby endowing the particular surface with desirable add-on electronic features. Systematic experimental, theoretical, and computational studies reveal the underlying mechanics mechanism and guide manufacturability for the transfer printing process in terms of scalability, controllability, and reproducibility.
- Files in This Item
-
Go to Link
- Appears in
Collections - 서울 공과대학 > 서울 기계공학부 > 1. Journal Articles
![qrcode](https://api.qrserver.com/v1/create-qr-code/?size=55x55&data=https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/190816)
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.